Reactive Ion etching

Oxford Instruments Plasma Technology NGP80 RIE, Parallel plate, samples up to 150mm diameter

  • Gases: CH4, O2, H2, Ar, CHF3, SF6
  • etching Si, SiO2, and Si3N4 films and custom etches

Surface Technology Systems ICP RIE, + loadlock, samples up to 150mm diameter

  •  Gases: CH4, O2, H2, Ar, BCl3, SF6, He, Cl2, CH4, N2
  • Process recipes for etching Diamond; Si; TiSi2; Al; GaAs and InP
  • Intellimetrics LEP 300 End Point detector

Surface Technology Systems ICP DRIE, + loadlock, samples up to 150mm diameter

  •   Gases: O2, Ar, SF6, CF4, C4F8
  • Advanced Silicon Etch (Bosch process) to 500+ µm; Shallow Si Etch